Knowledge

Via hole is one of the important components of multi-layer PCB, and the cost of drilling usually accounts for 30% to 40% of the PCB board manufacturing cost. Simply put, every hole on the PCB can be called a via. From a functional point of view, vias can be divided into two categories: one is used for electrical connections between layers; the other is used for fixing or positioning devices. From a process perspective, these vias are generally divided into three categories, namely blind vias, buried vias and through vias. Blind holes are located on the top and bottom surfaces of the printed circuit board and have a certain depth. They are used to connect the surface circuits and the inner circuits below. The depth of the holes usually does not exceed a certain ratio (aperture). Buried vias refer to connection holes located on the inner layer of a printed circuit board and do not extend to the surface of the circuit board. The above two types of holes are located in the inner layer of the circuit board. They are completed using the through-hole forming process before lamination. During the via-hole formation process, several inner layers may be overlapped.

The third type is called a through hole, which passes through the entire circuit board and can be used to implement internal interconnections or as mounting positioning holes for components. Because through holes are easier to implement in technology and have lower costs, most printed circuit boards use them instead of the other two via holes. The following via holes are considered as through holes unless otherwise specified.

From a design point of view, a via hole mainly consists of two parts, one is the drill hole in the middle, and the other is the pad area around the drill hole. The size of these two parts determines the size of the via. Obviously, when designing high-speed, high-density PCBs, designers always hope that the via holes should be as small as possible, so that more wiring space can be left on the board. In addition, the smaller the via holes, the smaller their own parasitic capacitance will be. The smaller it is, the more suitable it is for high-speed circuits. However, the reduction in hole size also brings about an increase in cost, and the size of the via hole cannot be reduced indefinitely. It is limited by process technologies such as drilling (drill) and electroplating (plating): the smaller the hole, the harder it is to drill. The longer the hole takes, the easier it is to deviate from the center; and when the depth of the hole exceeds 6 times the drill diameter, there is no guarantee that the hole wall will be evenly plated with copper. For example, if the thickness (through hole depth) of a normal 6-layer PCB board is 50 Mil, then under general conditions, the drilling diameter that the PCB manufacturer can provide can only reach 8 Mil. With the development of laser drilling technology, the size of drilled holes can also become smaller and smaller. Generally, vias with a diameter of less than or equal to 6 Mils are called microvias. Microvias are often used in HDI (High Density Interconnect Structure) design. Microvia technology allows vias to be drilled directly on the pad (Via-in-pad), which greatly improves circuit performance and saves wiring space.