Thermoelectric Separation Copper Based PCB
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Thermoelectric Separation Copper Based PCB
We are always honest with global customers, and there is no risk in cooperating with our company!
Layer: 2
Board thickness: 2.6mm
Material: Copper base
Surface treatment: Immersion Gold
Thermal conductivity:398w/m.k
Withstand voltage:AC1500V
Production process: thermoelectric separation process
Application: Building decoration industry
Advantages of thermoelectric separation copper substrate:
The copper substrate itself has strong thermal conductivity and good heat conduction and dissipation.
With thermoelectric separation structure: contact the lamp bead with zero thermal resistance, reduce the weak light of the lamp bead, and maximize the service life of the lamp bead;
High density, smaller volume under the same power.
It is suitable for matching with a single high-power lamp bead, especially COB packaging, so that the lamps can achieve better results.
Different structures shall be made according to different design requirements of lamps and lanterns, which will have boss shapes (copper bumps, copper recesses, parallel heat dissipation, etc.) after processing.