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This manufacturing process of copper substrate is relatively difficult, so the price of copper substrate is relatively expensive. Because of its own characteristics, copper substrate can not be replaced by aluminum substrate and FR-4 in some areas, as follows:

1. The copper base can be etched into fine patterns and processed into a boss shape. Components can be directly pasted on the boss to achieve excellent grounding and heat dissipation;
2. The copper base can be processed into metallized holes, while the aluminum base cannot. The network of metallized holes must be the same network, so that the signal has excellent grounding function. Secondly, the copper itself has weldable function, so that the planned structural parts can be welded after all.

Because the hardness of copper is relatively large, there are not many available thicknesses, only 1.0mm, 1.2mm, 1.5mm, 1.6mm and 2.0mm.