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High density interconnection (HDI) PCB is a technology for producing printed circuit boards. It is a circuit board with high line distribution density using micro blind hole and buried hole technology. With the continuous development of science and technology, in order to meet the electrical requirements of high-speed signals, the circuit board must provide impedance control with AC characteristics, high-frequency transmission capability and reduce unnecessary radiation (EMI). Sometimes, in order to reduce the quality problem of signal transmission, insulating materials with low dielectric coefficient and low attenuation rate are generally used. In order to better match the miniaturization and array of electronic components, the density of circuit boards is also constantly improved to meet the demand.