communication equipment PCBA
Excellent service, good quality, competitive price.
We are always honest with global customers, and there is no risk in cooperating with our company!
communication equipment PCBA
We are always honest with global customers, and there is no risk in cooperating with our company!
Layer :12
Board thickness: 2.8mm
Material: Rogers 4350B
Out layer copper thickness: 5OZ
Inner layer copper thickness: 3 OZ
Surface treatment: Immersion Silver
Minimum through hole: 0.3mm
Minimum line width/line spacing: 3 mil/ 3.5 mil
Application: Communication
Prodcut Type: OEM&ODM
PCB standard: IPC class 3
Main features of PCBA for 5G mobile communication terminal
1. High density
When it comes to the design of mobile terminals, no one millimeter of space is saved in the case, which can create huge value for terminal customers. By saving space, we can use larger and higher resolution displays, larger batteries, and more precise processors and components. All of these can enhance the functionality of the device and improve the overall user experience.
Large-scale MIMO (multivariable control system) antenna configuration and increasingly complex RF front-end will make RF lines occupy more space in 5G smart phones. Among other factors of the terminal, the processing capacity required to support massive 5G data may also affect the battery capacity and geometry. In this way, despite the increase in input/output demand, the space available for PCBA in 5G mobile terminals will still be significantly reduced.
2. High frequency and high speed
With the advent of the 5G era, the obvious change in the performance of the circuit board is high frequency and high speed. Because 5G, IOT and other applications will use higher frequencies, which will gradually rise from below 3GHz in the past to 6GHz or even 24-30GHz. Because the inherent frequency of 5G is higher, more strict impedance control is required. If it is not formed in a very precise way, the thinner line of 5G PCBA may increase the risk of signal attenuation and reduce data integrity.
3. High fever
There are “impedance” and “dielectric loss” in the signal transmission of PCBA, which increase with the signal high-frequency or high-speed digitization and high-power, so that PCBA continues to heat up.