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A layer of insulating alumina ceramic layer can be formed on the aluminum surface by anodizing, and an anodized alumina ceramic film aluminum substrate can be prepared by using the ceramic layer to replace the adhesive film in the aluminum substrate. Due to the high thermal conductivity of ceramic film, the “overall thermal resistance” of aluminum substrate using this technology can be reduced to 0.34, which can match the heat dissipation load of high-power LED lamp beads. The dielectric strength of the anodized aluminum ceramic film can reach 120, and the insulation resistivity is greater than 10~6, meeting the insulation requirements of LED lighting lamps. The research of LED junction temperature and voltage drift shows that the thermal resistance of aluminum substrate is 2.1 lower than that of copper substrate, and the junction temperature at rated current is 20 lower than that expected in theory. To sum up, anodized aluminum substrate with ceramic film has obvious advantages in the application of high-power LED lamp beads.