8L 2+N+2 communication PCB

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Layer : 8

Board thickness: 2.0 mm

Material: ITEQ 180

Construction: 2+4+2 HDI PCB

Out layer copper thickness: 3 OZ

Inner layer copper thickness: 5 OZ

Surface treatment: Immersion gold 2U”+ OSP

Application: Communication

Minimum hole: 0.1 mm

Minimum line width/line spacing: 3 mil/ 3.2 mil

HDI PCB can be divided into: 1st, 2nd, 3rd, 4th and any layer interconnection

1-stage HDI structure: 1+N+1 (pressing twice, laser once)

2-stage HDI structure: 2+N+2 (3 times of pressing, 2 times of laser)

3-stage HDI structure: 3+N+3 (4 times of pressing, 3 times of laser)

4-stage HDI structure: 4+N+4 (5 times of pressing, 4 times of laser)