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Layer :8
Board thickness: 0.2mm
Material: Polyimide
Copper thickness: 1/3 oz
Surface treatment: ENIG
Application: Automotive electronics
Minimum line width/line spacing: 0.075mm/0.1mm
Minmum drilling: 0.35mm
Stiffener: FR4
The commonly used reinforcing materials for FPC reinforcement are as follows:
Polyimide (PI), FR4 and steel sheet
multilayer flexible PCB
multilayer flexible PCB
8-layer multilayer flexible circuit board, 0.2mm thick, ideal for automotive electronics, using Polyimide material and ENIG surface treatment.