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The materials, equipment and manufacturing process of the Rigid Flex PCB are different from those of the original Flex PCB and Rigid PCB. In terms of materials, the Rigid board is made of FR4 of PCB, while the Flex board is made of PI or PET. The two materials have different joint and hot compression shrinkage rates, which is a difficult point for the stability of the product. In addition to the consideration of the stress in the XY axis direction, the stress bearing in the Z axis direction is also an important consideration due to the three-dimensional space configuration characteristics of the Rigid Flex board, At present, material suppliers provide PCB hard board or soft board manufacturers with improved materials suitable for Rigid Flex PCB, such as epoxy resin or resin, to meet the bonding problem between Rigid boards or Flex boards.

In terms of equipment, due to the difference between the material characteristics and product specifications of the Rigid Flex, the equipment in the pressing and copper plating parts must be corrected. The applicability of the equipment will affect the yield and stability of the products. Therefore, the applicability of the equipment must be considered before entering the production of the soft and hard bonding plates.