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The production process of ceramic PCB includes the following steps:

1. Raw material preparation: The first step in the production process is to prepare the raw material. For ceramic substrates, aluminum nitride powder is mixed with a binder and solvent to form a slurry.
2. Substrate molding: Then pour the slurry on a flat surface and spread it evenly. Excess paste is removed and substrates are formed by drying the paste and cutting it into the desired size and shape.
3. Green body processing: Next, the substrate is treated to remove any residual solvent and then heated at high temperature to form a green body. The green body is the final stage before sintering.
4. Sintering: The green body is fired at high temperature to make the matrix dense and hard. This step is critical as it determines the final quality of the ceramic substrate.
5. Metallization: After sintering, a thin layer of metal is coated on the ceramic substrate to form a circuit. This process is usually done by vapor deposition process or screen printing.
6. Etching: The circuit is then etched to remove any excess metal, leaving the desired circuit pattern.
7. Via formation: Vias are drilled in the substrate to allow connection of circuit layers. 8. Surface treatment: Finally, a protective layer is applied on the surface of the substrate to prevent oxidation and provide insulation.

The final product is a ceramic PCB with excellent thermal, mechanical and electrical properties for high power and high frequency application