Excellent service, good quality, competitive price.

12 layer manfacturing process:
Cut material to size→Bake material→Inner layer drilling→Inner layer pattern transfer→Inner layer circuit inspection→Etch/stripping→Etch inspection→Browning→Prepreg preparation→layers Pressing→Cutting copper foil→Positioning→Laminating→Drilling→Desmear removal→Immersion copper→Image and text transfer→Circuit inspection→Copper and tin plating→Film removal Etching→Tin removal→Etching inspection→Dielectric inspection test→Solder mask inspection→Character→Baking→surface treatment→Shape→V-Cut→Electrical test→Final inspection→Packaging