In order to optimize rail transit PCB to improve the stability and safety of train operation, the following aspects can be considered:

1. Improve the reliability and stability of PCB boards. Choose high-quality materials: Select PCB board materials with high reliability, long life and good heat resistance to ensure stable operation in harsh environments. Optimize manufacturing process: Through precise manufacturing process, reduce defects and defective rates in the manufacturing process and improve the overall quality of PCB boards. Redundant design: Redundant design is adopted in key components and signal transmission paths. Once a component fails, other components can take over the work to ensure continuous operation of the system.

2. Optimize the wiring design of PCB boards to reduce electromagnetic interference: Reasonably design the wiring to avoid cross interference and crosstalk between signal lines and reduce the impact of electromagnetic interference on system performance. Improve signal quality: Through reasonable wiring design, reduce signal attenuation and distortion, and improve the accuracy and reliability of signal transmission. Consider signal integrity: When transmitting high-speed signals, special attention should be paid to signal integrity issues, and appropriate topology and termination methods should be adopted to ensure signal quality.

3. Strengthen thermal management and arrange heat dissipation devices reasonably: Reasonably arrange heat dissipation devices such as heat sinks and heat pipes on PCB circuit boards to improve the conduction and dissipation efficiency of heat. Optimize the heat dissipation structure: Design a reasonable heat dissipation structure, such as increasing the heat dissipation area, using high-efficiency heat dissipation materials, etc., to ensure that the PCB board can work stably in a high temperature environment.

4.Enhance protection measures and select protective materials: Apply protective coatings or use protective materials on the surface of the PCB board to increase its ability to resist harsh environments, such as moisture-proof, dust-proof, and corrosion-proof. Conduct reliability tests: Conduct strict reliability tests during the design and manufacturing process to ensure that the PCB board can work normally under various harsh conditions.

5. Use intelligent technology to introduce intelligent monitoring: Integrate intelligent monitoring modules on the PCB board to monitor the operating status and parameters of the system in real time, and promptly discover and deal with potential problems. Intelligent scheduling and optimization: Combine big data and artificial intelligence technologies to intelligently schedule and optimize train operations to improve operating efficiency and safety.

6. Follow the fail-safe principle to design a fail-safe system: Follow the fail-safe principle in the design of the PCB board, that is, when a system or component fails, it can automatically switch to a safe state to prevent accidents. Strengthen fault detection and diagnosis: By improving fault detection and diagnosis capabilities, quickly and accurately locate the problem, and take appropriate measures to deal with it.

The above measures can significantly improve the performance and reliability of rail transit PCB boards, thereby ensuring the stability and safety of train operation.

Conducting signal integrity analysis of FPC (Flexible Printed Circuit) impedance board is a complex process involving multiple steps and techniques. Here are some basic steps and considerations:

1. Understand the characteristics of FPC impedance board: First, you need to have a deep understanding of the material characteristics, design structure and working environment of FPC impedance board, all of which will affect the transmission and integrity of the signal.

2. Select appropriate test equipment: In order to accurately measure and analyze the signal, you need to select appropriate test equipment, such as oscilloscopes, spectrum analyzers, etc. These devices should have sufficient bandwidth and accuracy to capture and analyze high-speed signals.

3. Perform waveform testing: Waveform testing is the basis of signal integrity testing. Use an oscilloscope to measure the amplitude, rise time, fall time and other parameters of the signal to observe whether the signal is distorted or distorted. In addition, you can also analyze whether the edge time, jitter and other indicators of the signal meet the requirements.

4. Perform eye diagram testing: Eye diagram testing is a commonly used signal integrity test method that can help evaluate jitter, noise and other interference factors of the signal during transmission. Through the eye diagram test, you can determine whether the signal can remain stable and clear in a noisy and interfering environment.

5. Consider impedance matching: Impedance matching is critical for signal integrity. In the design of the impedance FPC board, the impedance matching of the transmitting and receiving ends should be ensured to reduce the reflection and distortion of the signal. In addition, attention should be paid to the continuity and consistency of the impedance to ensure that the signal remains stable throughout the transmission process.

6. Analyze the impact of capacitance on the signal: In the FPC impedance board, the capacitance will affect the transmission of the signal. For example, when a fast-rising step signal reaches the capacitor, the capacitor will charge quickly, which will affect the rise time and amplitude of the signal. Therefore, when analyzing signal integrity, the impact of capacitance on the signal needs to be considered.

7. Use simulation tools: Using simulation tools for signal integrity analysis is an effective method. These tools can simulate according to the design parameters and material properties of the FPC impedance board to predict the transmission performance and possible problems of the signal. Through simulation analysis, problems can be found and solved in the design stage, reducing the cost of later testing and modification.

8. Comprehensive evaluation: Finally, the signal integrity of the FPC impedance board needs to be comprehensively evaluated. According to the test results and the results of simulation analysis, it is judged whether the signal remains stable and clear during the transmission process and whether it meets the design requirements and application needs. If there are problems, corresponding optimization and improvement are required.

Signal integrity analysis of impedance board FPC requires comprehensive consideration of multiple factors, and the use of multiple test methods and simulation tools for analysis and evaluation. Only in this way can we ensure that the signal remains stable and clear during transmission and meet design requirements and application needs.

 

There are many aspects to consider when designing FPV camera circuit boards, which are related to the performance, stability and final application scenarios of the circuit board. Here are some key design considerations:

1. Processor performance: The circuit board should use a high-performance processor that can quickly process images and flight data to meet the real-time and response speed requirements of FPV cameras.

2. Sensor integration: Integrate high-quality sensors such as gyroscopes and accelerometers to ensure the stability and accuracy of the aircraft during high-speed flight. For photography purposes, special sensors such as magnetometers and barometers for stable video may also need to be integrated.

3. Power management: Design an efficient power management system to support fast and frequent speed changes. At the same time, considering the need for long-term shooting, ensure continuous and stable power output.

4. Signal transmission: Optimize signal transmission design to support long-distance and low-latency signal transmission to ensure that pilots can respond to track conditions or obtain clear images in real time.

5. Interface configuration: Configure sufficient PWM outputs and UART ports according to application requirements to connect various actuators, servo mechanisms, cameras and other imaging devices.

6. Firmware function: Develop firmware with multiple flight modes and tuning options to suit different tracks and flying styles or specialized image processing and video recording functions.

7. Heat dissipation design: Since long-term high-speed operation may cause overheating, a good heat dissipation system needs to be designed to prevent overheating.

8. Durability design: Considering the possibility of impact and collision, the design of the circuit board should be more robust, especially the circuit board for racing. The circuit board for photography may pay more attention to protective measures such as waterproof and dustproof.

The design of the FPV camera circuit board needs to comprehensively consider multiple aspects such as processor performance, sensor integration, power management, signal transmission, interface configuration, firmware function, heat dissipation design and durability to ensure that the circuit board is used in the FPV camera to achieve the best performance and stability.

 

In the rapidly developing field of electronic manufacturing, high-density interconnect (HDI) circuit boards have become the core components of many electronic products due to their excellent performance and wide application. However, HDI circuit boards often encounter some quality problems during the manufacturing process. How to effectively deal with these problems is the key to improving product quality and ensuring market competitiveness.

Common quality problems and causes

Circuit breakage and short circuit: Due to the high integration and precision design of HDI boards, the circuit spacing is small, and the slightest carelessness during processing may cause circuit breakage or short circuit.

Poor welding: Problems such as loose welding points, cold welding, etc. will seriously affect the electrical performance and reliability of HDI boards.

Material problems: The quality of materials such as substrate materials, copper foil, and solder mask ink is unstable, which will lead to the overall performance of HDI boards.

Improper process control: Improper control of key processes such as etching, drilling, and electroplating will also lead to quality problems.

Effective response strategy

Optimized design and reasonable process design: Fully consider the characteristics of HDI boards in the design stage, reasonably layout the circuits, and avoid overly compact designs.

Process optimization: According to the characteristics of HDI boards, optimize key processes such as etching, drilling, and electroplating to ensure processing accuracy and stability.

Strict material screening and control Supplier selection: Select reputable and quality-guaranteed suppliers to ensure the quality of raw materials. Material testing:

Strictly test the raw materials entering the factory to ensure that they meet the standards. Strengthen process control and quality testing Process monitoring: Establish a complete process control system to monitor and record key processes in real time. Quality testing: Introduce advanced testing equipment to conduct comprehensive and detailed quality testing of HDI boards.

Improve employee skills and awareness Skill training: Strengthen employee skills training to improve employees’ understanding and response capabilities to HDI board quality issues. Quality awareness: Improve employees’ quality awareness so that every employee understands the importance of quality.

Establish a quality management system System establishment: Establish a complete quality management system, from design, raw materials, production to testing, each link has clear standards and processes. Continuous improvement: Through regular quality reviews and internal audits, problems are discovered and continuously improved.

 

The response to HDI circuit board quality issues requires us to start from multiple aspects, including optimizing design and process, strict material screening and control, strengthening process control and quality testing, improving employee skills and awareness, and establishing a quality management system. Only in this way can we ensure that the quality of HDI circuit boards is stable and reliable and meets market demand.

Thick copper PCB plays an important role in many fields with its high current carrying capacity, excellent thermal management performance and enhanced mechanical strength.
With the continuous development of electronic technology, the requirements for the current conduction and carrying capacity of circuit boards are getting higher and higher. Thick copper PCB has gradually become an important trend in the electronics field due to its unique material properties. Thick copper PCB mainly refers to the use of copper foil thicker than standard PCB in the manufacturing process. The copper thickness is usually 105 microns (3OZ) and above, and sometimes even up to 400 microns (12OZ).

Thick copper PCBs are widely used in the industrial field, especially in industrial automation, industrial robots, power supply systems, and renewable energy systems.
Today, SHENZHEN BEST PCBA CO., LIMITED introduces two thick copper PCBs. Both are 4-layer through-hole boards. The copper thickness requirements are 6OZ inside and 6OZ outside, and 3OZ inside and 10OZ outside! Let’s take a look at these two PCB:

           

The dark green PCB is a product with 3OZ inside and 10OZ outside, and the light green PCB is a product with 6OZ inside and 6OZ outside. Let’s take a look at their slice diagrams:

           

The circuit design of thick copper PCB is relatively simple, but it is difficult to control the parameters during the production process!

Material selection: For 10OZ thick copper circuit boards, prepregs with high resin content need to be selected to ensure that the amount of glue flowing from the interlayer prepregs is sufficient to fill the inner layer graphics, while avoiding quality problems such as too thick insulating dielectric layers causing the finished board to be too thick or too thin, resulting in delamination, high-voltage test failure, etc.

Pressing production: The copper thickness of thick copper plates cannot be completed by electroplating and powering up like ordinary PCBs. The copper thickness of 10OZ is achieved by pressing 0.3mm copper plates on both sides of the core board, and then electroplating and powering up. The pressing of copper plates is much more difficult than that of copper foil.

Drilling production: When using special plates with high TG, high speed, high frequency, and thick copper, the difficulty of drilling roughness, drilling burrs, and drilling pollution is increased. The cumulative total copper thickness and board thickness of multilayer boards make it easy for drilling knives to break, and the problem of oblique drilling caused by board thickness is a production difficulty.

Circuit production: Due to the thick copper foil, it is difficult to etch out the complete circuit by conventional etching methods. Different factories have their own etching technology for thick copper PCBs. We also adjust the process for different products, accurately control the etching depth and shape, and ensure the quality of circuits and holes.