3oz inner layer and 10oz outer layer/6oz inner layer and 6oz outer layer thick copper PCB

Thick copper PCB plays an important role in many fields with its high current carrying capacity, excellent thermal management performance and enhanced mechanical strength.
With the continuous development of electronic technology, the requirements for the current conduction and carrying capacity of circuit boards are getting higher and higher. Thick copper PCB has gradually become an important trend in the electronics field due to its unique material properties. Thick copper PCB mainly refers to the use of copper foil thicker than standard PCB in the manufacturing process. The copper thickness is usually 105 microns (3OZ) and above, and sometimes even up to 400 microns (12OZ).

Thick copper PCBs are widely used in the industrial field, especially in industrial automation, industrial robots, power supply systems, and renewable energy systems.
Today, SHENZHEN BEST PCBA CO., LIMITED introduces two thick copper PCBs. Both are 4-layer through-hole boards. The copper thickness requirements are 6OZ inside and 6OZ outside, and 3OZ inside and 10OZ outside! Let’s take a look at these two PCB:

           

The dark green PCB is a product with 3OZ inside and 10OZ outside, and the light green PCB is a product with 6OZ inside and 6OZ outside. Let’s take a look at their slice diagrams:

           

The circuit design of thick copper PCB is relatively simple, but it is difficult to control the parameters during the production process!

Material selection: For 10OZ thick copper circuit boards, prepregs with high resin content need to be selected to ensure that the amount of glue flowing from the interlayer prepregs is sufficient to fill the inner layer graphics, while avoiding quality problems such as too thick insulating dielectric layers causing the finished board to be too thick or too thin, resulting in delamination, high-voltage test failure, etc.

Pressing production: The copper thickness of thick copper plates cannot be completed by electroplating and powering up like ordinary PCBs. The copper thickness of 10OZ is achieved by pressing 0.3mm copper plates on both sides of the core board, and then electroplating and powering up. The pressing of copper plates is much more difficult than that of copper foil.

Drilling production: When using special plates with high TG, high speed, high frequency, and thick copper, the difficulty of drilling roughness, drilling burrs, and drilling pollution is increased. The cumulative total copper thickness and board thickness of multilayer boards make it easy for drilling knives to break, and the problem of oblique drilling caused by board thickness is a production difficulty.

Circuit production: Due to the thick copper foil, it is difficult to etch out the complete circuit by conventional etching methods. Different factories have their own etching technology for thick copper PCBs. We also adjust the process for different products, accurately control the etching depth and shape, and ensure the quality of circuits and holes.

 

HDI Light Board

In today’s digital age, LED displays have become an indispensable element in the fields of information display, advertising, and event hosting. One of the key technologies that supports this visual feast is high-quality PCB boards. PCB is the “skeleton” of electronic products, while the PCB of LED displays is its “soul”.

In indoor and outdoor display screens, 2-layer or 4-layer applications are the most common. Small pitch LED display screens use more layers of circuit boards to meet the requirements of high-density signal transmission. In transparent LED display screens, technology research and development continues to advance to reduce costs and improve efficiency.

The wiring density of the inner and outer layers of the PCB for LED display screens is extremely high. Generally, the minimum line width and line spacing of the inner and outer layers is 3.5mil. The design characteristics of COB-type LED display screens determine that the minimum line width and line spacing are required to be 2.5mil, and the corresponding outer copper thickness is recommended to be 1OZ to ensure the yield of dense lines. This requires precise control of the line width and spacing during the production process to ensure the normal function and high-quality display of the display screen.

SHENZHEN BEST PCBA CO., LIMITED has invested a lot of time and energy in the research and development and production of LED screen light board PCB, continuously optimizing the production process and improving the process capability of the light board!

For some conventional transparent screens and large-pitch lamp bead PCBs, our yield rate can now reach over 90%. For small-pitch through-hole lamp boards, we can guarantee that all orders with a pitch of P1.95 or above will be delivered in one go. For HDI lamp boards, the minimum lamp bead pitch we can produce is P0.98!

Our company currently has very good leadership in all kinds of straight screens, special-shaped screens, first-order and second-order HDI light boards, with an overall yield rate of over 75%!

18-layer mechanical blind hole + step + back drilling + immersion gold + gold plating 30U + M6 high-speed circuit board

With the development of science and technology, information and communication technology are changing with each passing day, and people’s requirements for computer performance are getting higher and higher. Correspondingly, the hardware requirements for computer communication equipment are also getting higher and higher. PCB is the basic product of electronic equipment, and its high-end precision determines the performance of the entire finished computer communication equipment!

Today, SHENZHEN BEST PCBA CO., LIMITED brings you an FPGA acceleration card for high-performance computing and network acceleration devices. Let’s first take a look at what the PCB board looks like.

The bright red solder mask ink, immersion gold + electroplated gold finger 30U” surface treatment process make the whole product look very high-end. But what really attracts people to this product is not just its appearance, but its complex design and precise production process.
First of all, let’s take a look at its step process.


The conventional step process is to use non-flowing glue PP to press and stack the layers in the step part. And our product needs to achieve a high-speed effect, so the whole board uses Panasonic M6 PCB high-speed board, but there is no non-flowing glue PP corresponding to M6 on the market. We can only use flowing glue PP for pressing, which is very challenging for the production of step parts.
In addition, this product is also an 18-layer mechanical blind hole board. Let’s take a look at the pressing structure diagram

The motherboard of the product is divided into two boards, L1-4 and L5-18, and the finished product is made after three laminations. The lamination of multi-layer boards is extremely difficult, and the lamination of multi-layer special board products must be controlled in detail. The result of a mistake is that all the previous efforts are wasted!
Finally, in order to ensure the transmission of high-speed signals, reduce signal attenuation, ensure that the signal is stronger and more reliable, and also to prevent signal distortion problems, we also added back drilling technology in product production.
CKT-1 drills from the top layer to the bottom layer with a depth of 1.25+/-0.05, CKB-1 drills from the bottom layer to the top layer with a depth of 0.35mm and a depth of 1.45+/-0.05, 0.351mm with a depth of 1.25+/-0.05, 0.352mm with a depth of 1.05+/-0.05, and 0.353mm with a depth of 0.2+/-0.05.

18-layer of arbitrary interconnect HDI

The PCB industry has experienced years of development, and the technology is gradually maturing and stabilizing. Starting from the newly started single- and double-sided boards, then the multi-layer boards that need to be pressed once, and then to HDI, the integration of PCB products is getting higher and higher!

However, information and communication technology is changing with each passing day. The latest chip manufacturing process has reached 5nm or even 3nm. The faster and faster CPU data processing speed has put higher and higher performance requirements on PCB circuit boards. Those conventional low-level HDI boards can no longer meet the needs of these high-end electronic devices. Therefore, multi-layer, high-level, and even arbitrarily interconnected PCB products have begun to appear in people’s vision.

Below is an 18-layer interconnected HDI that we recently produced for a customer. Let’s take a look at its style:

Just looking at the appearance, the dark blue ink is matched with the gold surface of the immersion gold process, and the high-density BGA pads all show its noble temperament! However, his aura does not only come from his appearance. With 18 layers, he contains extremely complex processes inside.

HDI stacking structure: conventional products in the industry are 1-3 order HDI. The more orders, the greater the probability of layer deviation. This product is 18 layers of arbitrary interconnection. Between the layers of the PCB, any layer is connected to each other. There are more than 30 sets of blind holes and buried holes. The design combination is very complex and the processing process is very long.
Hole connection method: Through the L9-10 layer core board superimposed 8 times of pressing, superimposed 8 times of laser drilling and electroplating filling, the minimum mechanical aperture is 0.15mm, and the minimum laser aperture is 0.1mm. Let’s take a look at its slice diagram:

Multiple laminations of the core board can easily lead to unlimited expansion and contraction of the core board, resulting in the scrapping of the layer. Therefore, during the lamination process, we are extremely strict in controlling the parameters.

During the production process, we must first consider the circuit pre-release coefficient, which directly affects the production of subsequent boards. Especially in the production of this PCB, since it involves 8 laminations, each lamination will produce a certain expansion and contraction, so it is necessary to adjust the pre-release coefficient to ensure the accuracy and quality of the circuit board. The setting of the pre-release coefficient is one of the key process parameters, which is crucial to ensure the electrical performance and mechanical strength of the PCB!

Interlayer alignment: Due to the large number of layers of HDI boards, ensuring precise alignment between each layer is a huge challenge. Any slight deviation may cause circuit performance degradation or short circuit.

Laser drilling: The laser aperture is 0.1mm. It is difficult for the laser machine to accurately grasp the target position during the expansion and contraction caused by multiple laminations. The laser target and line LDI production parameters of the laser need to be adjusted.
Fine circuit processing: The product circuit is very fine, with a line width and line spacing of 0.06/0.06mm, which requires extremely high processing accuracy. The processing of fine circuits requires the use of high-end processing equipment and sophisticated production technology to ensure the accuracy and stability of the circuit.

Understand the main functions of printed circuit boards: choose the right one for your project!

In today’s technological wave, the importance of printed circuit boards (PCBs) as an indispensable component in electronic devices is self-evident. Whether it is smartphones, computers, medical devices, automotive electronics, or even aerospace equipment, printed circuit boards are indispensable. So, what is the role of printed circuit boards? How can we choose the right circuit board according to project requirements?

The main function of printed circuit boards

Connection function
One of the core functions of printed circuit boards is connection. It can connect different electronic components through wires to form a complete circuit system. Through printed circuit boards, these components can work according to predetermined logic and sequence to achieve various complex functions.

Support function
In addition to the connection function, printed circuit boards can also provide stable support for electronic components. Electronic components are fixed on printed circuit boards to form a compact and stable overall structure. This structure can not only protect electronic components from interference and damage from the external environment, but also improve the stability and reliability of the entire circuit system.

Heat dissipation
In electronic equipment, as electronic components work, a lot of heat will be generated. If this heat cannot be dissipated in time, the performance of electronic components will be degraded or even damaged. The metal conductors and copper foil layers on the printed circuit board can effectively conduct heat to the surface of the circuit board, and then dissipate the heat into the air through devices such as radiators, thereby ensuring the normal operation of electronic components.

How to choose a suitable circuit board
Determine the type of circuit board according to project requirements
Before choosing a circuit board, you must first clarify the specific needs of the project. For example, the scale, complexity, and working environment of the project will affect the choice of circuit boards. For example, for projects that need to withstand harsh environments such as high temperature and high humidity, it is necessary to choose circuit boards with good heat and humidity resistance; for projects that need to achieve high-frequency transmission, it is necessary to choose circuit boards with lower impedance and higher bandwidth.

Consider the performance parameters of the circuit board
When choosing a circuit board, you also need to consider the performance parameters of the circuit board. For example, the number of layers, wire width, wire spacing, copper foil thickness, etc. of the circuit board will affect the performance of the circuit board. Generally speaking, the more layers, the wider the wire width, the smaller the wire spacing, and the thicker the copper foil, the better the performance of the circuit board. However, these parameters will also affect the cost and difficulty of making the circuit board. Therefore, when choosing a circuit board, you need to weigh it according to the actual needs of the project.

Choose reliable suppliers and manufacturers
When choosing a circuit board, you also need to choose reliable suppliers and manufacturers. A good supplier and manufacturer can provide high-quality circuit board products and can provide perfect after-sales service and technical support. Therefore, when choosing a circuit board, it is necessary to conduct in-depth investigation and understanding of the supplier and manufacturer to ensure that they have sufficient strength and credibility.

As an indispensable component in electronic equipment, the importance of printed circuit boards is self-evident. When choosing a circuit board, it is necessary to make comprehensive considerations based on the specific needs of the project, select the appropriate circuit board type and performance parameters, and select reliable suppliers and manufacturers. Only in this way can the smooth progress of the project and the high-performance operation of electronic equipment be guaranteed.

What are the types of high-frequency PCB material?

With the continuous advancement of science and technology, high-frequency circuit boards (PCBs) are increasingly used in modern electronic fields, especially in wireless communications, radar systems, satellite navigation and other fields. The core of a high-frequency circuit board lies in the selection of its board materials. Suitable board materials can significantly improve the performance of the circuit board. So, what are the types of high-frequency PCB boards? This article will give you an in-depth understanding and help you make accurate selection.

Types of pcb high frequency boards
Polytetrafluoroethylene (PTFE) sheet

PTFE sheet is one of the most commonly used sheets in high-frequency circuit boards. Its notable feature is its extremely low dielectric constant and loss tangent. This means that the signal loss during transmission is extremely low, ensuring signal stability and transmission quality. In addition, PTFE sheets also have good thermal stability and chemical corrosion resistance, and are suitable for various harsh environments.

Polyimide (PI) sheet
PI sheets also have excellent electrical properties and thermal stability, making them a good choice for high-frequency circuits. Its low dielectric constant and loss tangent help reduce energy loss during signal transmission. At the same time, PI sheets also have excellent mechanical properties and weather resistance, and can cope with various complex application scenarios.
ceramic plate

Ceramic sheets perform well in high-frequency and high-power circuits due to their high thermal conductivity and high temperature resistance. Although it is more expensive and difficult to process, the excellent properties of ceramic sheets make them ideal for specific applications. For example, in high-temperature, high-power radar systems, ceramic plates can ensure the stable operation of circuit boards.

How to accurately select
Application scenarios
Different application scenarios have different performance requirements for high-frequency boards. For example, wireless communication systems pay more attention to signal transmission quality and stability, while radar systems have higher requirements for the thermal stability and high temperature resistance of plates.

Electrical properties
Electrical performance parameters such as dielectric constant and loss tangent are key factors affecting the performance of high-frequency circuit boards. We need to choose the appropriate board material according to specific needs to ensure fast signal transmission and low loss.
Thermal stability and chemical resistance
For circuit boards that need to work in high temperatures or harsh environments for a long time, we need to choose boards with good thermal stability and chemical resistance.

Cost and processing difficulty
When selecting plates, we also need to consider cost and processing difficulty. Although some high-performance boards have superior performance, they are more costly or difficult to process and may not be suitable for all application scenarios.

There are many types of PCB high-frequency boards, and each board has its own unique performance and applicable scenarios. By having an in-depth understanding of the characteristics and performance parameters of various boards, we can select the appropriate board according to specific needs to ensure the performance and stability of the circuit board.

What is a communication PCB? How does it affect the quality of our daily communications?

In this era of information explosion, communication technology has long penetrated into every aspect of our lives. However, do you know that behind every smooth video call and every instant message, there is an unsung hero – communication PCB (printed circuit board)? Today, let us unveil its mystery and explore how it affects the quality of our daily communications.

PCB, or printed circuit board, is a basic component used to connect electronic components in electronic devices. And communication PCB, specifically refers to those circuit boards used in communication equipment, which carry core functions such as signal transmission and data processing, and are the “nerve center” for the normal operation of communication equipment.

So, how does communication PCB affect the quality of our daily communications?
In terms of signal transmission, the design of communication PCB plays a vital role in the integrity and accuracy of the signal. A high-quality PCB design can ensure that the loss of the signal during transmission is minimized, thereby ensuring the clarity and reliability of communication. On the contrary, an unreasonable PCB design may cause signal attenuation, distortion, and even communication interruption.

Stability is another key indicator of communication equipment. The material, process and design of communication PCB directly affect the stability of the equipment. High-quality PCBs can resist interference from the external environment and reduce equipment failures, thereby ensuring the continuity and stability of communication.


Compatibility is also an issue we have to consider. With the continuous advancement of communication technology, new communication standards and interfaces are emerging in an endless stream. A good communication PCB should have a good forward-looking design, be able to adapt to future technology upgrades and changes, and ensure that users do not need to replace the entire communication system when replacing equipment or upgrading services.

In order to understand the importance of communication PCBs more intuitively, we can look at the construction of 5G base stations. 5G base stations have extremely high performance requirements for PCBs, because 5G signals have fast transmission speeds and large data processing volumes, which puts higher requirements on the signal transmission capacity and stability of PCBs. Only high-quality communication PCBs can ensure the stable transmission of 5G signals and provide users with a smoother communication experience.

Faced with such an important communication PCB, how should we improve its performance and user experience?
Choosing high-quality PCB materials and advanced manufacturing processes is the key. The design of PCBs also needs to keep pace with the times and constantly introduce new design concepts and technologies to adapt to the rapid development of communication technology. A strict quality control system is also essential to ensure that each communication PCB meets the expected performance standards.

As the core component of communication equipment, the performance of communication PCB is directly related to the quality of our daily communication. Understanding and valuing the role of communication PCB and choosing high-quality PCB products and services will be the key to improving the quality of our communication.

In-depth analysis: What are rigid-flex boards and their application scenarios!

With the rapid development of modern electronic technology, hard-flex boards, as a special electronic material, have gradually become an indispensable part of electronic equipment manufacturing.

1. What is a hard-flex board
As the name implies, a hard-flex board combines a flexible circuit board (FPC) and a rigid circuit board (PCB) through a specific process to form a circuit board that combines the softness and bendability of FPC with the firmness and stability of PCB. The hard-flex board not only retains the flexibility and bendability of FPC, but also has the high reliability, high stability and strong electrical performance of PCB.


2. Characteristics of hard-flex boards
Soft and bendable: Due to the use of FPC materials, the hard-flex board can be bent freely within a certain range to adapt to electronic devices of various complex shapes and structures. This makes the hard-flex board have unique advantages in the fields of wearable devices, flexible displays, etc.
High reliability: The hard-flex board combines the firmness and stability of PCB and has high reliability and stability. It can work normally in various harsh environments and meet various special application requirements.

Excellent electrical performance: The hard-flex board adopts advanced electrical design technology and has excellent electrical performance. It can meet the needs of various complex circuits and provide stable and reliable electrical connections for electronic devices.

3. Application scenarios of rigid-flex boards
Wearable devices: With the popularity of wearable devices, the requirements for the softness and bendability of electronic materials are getting higher and higher. Rigid-flex boards are ideal for wearable devices because of their soft and bendable characteristics. They can make the device light, comfortable and have a good user experience.

Flexible display screens: As an emerging display technology, flexible displays have extremely high requirements for materials. Rigid-flex boards are one of the key materials for flexible displays because of their softness and impact resistance. They can achieve morphological changes such as bending and folding of display screens, bringing users a new visual experience.
Aerospace: In the aerospace field, electronic equipment needs to withstand extreme environmental conditions, such as high radiation and high pressure. Rigid-flex boards can meet these special needs with their high temperature resistance and high reliability. They can provide stable and reliable electrical connections for aerospace electronic equipment to ensure the normal operation of the equipment.

With the continuous advancement of electronic technology and the continuous expansion of the market, the application fields of rigid-flex boards will be more extensive. In the future, rigid-flex boards will play a more important role in wearable devices, flexible displays, aerospace and other fields. At the same time, with the continuous improvement and optimization of manufacturing processes, the performance of rigid-flex boards will be further enhanced, providing more solid support for the development of electronic equipment.

How does the rigid-flex PCB market contribute to the development of the new energy vehicle industry?

With the global attention to environmental protection and sustainable development, the new energy vehicle industry is ushering in a golden period of vigorous development. Against this background, the rigid-flex board market, with its unique advantages, is becoming an indispensable part of the new energy vehicle industry.

1. Application of rigid-flex boards in new energy vehicles
Battery management system: The battery management system is the “heart” of new energy vehicles, responsible for monitoring battery status, managing battery charging and discharging processes, etc. With its excellent electrical performance and reliability, the rigid-flex board ensures the efficient operation of the battery management system, thereby ensuring the endurance and safety of new energy vehicles.
Motor control system: The motor control system is the power source of new energy vehicles, and has extremely high requirements for circuit connection and signal transmission. The high-frequency signal transmission capability and excellent mechanical properties of the rigid-flex board provide a stable operating environment for the motor control system, ensuring the power performance and driving experience of new energy vehicles.
On-board electronic system: With the development of intelligent and networked new energy vehicles, on-board electronic systems are becoming more and more complex. With its thin and foldable characteristics, the rigid-flex board realizes the high integration and miniaturization of on-board electronic systems, meeting the requirements of new energy vehicles for space utilization and portability.
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II. The driving role of the soft-hard board market in the new energy vehicle industry
Improve the performance of new energy vehicles: The high performance of the soft-hard board provides a stable operating environment for the key components of new energy vehicles, thereby improving the performance of new energy vehicles. Whether it is the cruising range, power performance or driving experience, the soft-hard board plays an important role.
Promote technological innovation of new energy vehicles: With the continuous advancement of soft-hard board technology, the technological innovation of new energy vehicles has also been accelerated. For example, the application of soft-hard boards has promoted the integration and intelligence of vehicle electronic systems, bringing more possibilities for new energy vehicles.

Reducing the cost of new energy vehicles: The thin and foldable characteristics of the soft-hard board have achieved high integration and miniaturization of new energy vehicle equipment, reducing the consumption of materials and energy. At the same time, with the improvement of production technology and the increase in the degree of automation, the cost of the soft-hard board is also gradually decreasing, providing greater cost advantages for the new energy vehicle industry.
III. Challenges and opportunities faced by the soft-hard board market

Although the soft-hard board market plays an important role in the new energy vehicle industry, it also faces some challenges. For example, technical difficulty and cost issues are still the main factors restricting the development of the soft-hard board market. However, with the rapid development of the new energy vehicle industry and the continuous growth of market demand, the rigid-flex board market has also ushered in huge opportunities.

In order to seize opportunities and meet challenges, the rigid-flex board market needs to increase R&D investment and promote technological innovation and industrial upgrading. At the same time, strengthen cooperation and exchanges with the new energy vehicle industry, deeply understand market demand and technological trends, and provide the new energy vehicle industry with better quality and more efficient products and services.

The rigid-flex board market is becoming an indispensable part of the new energy vehicle industry with its unique advantages. Through technological innovation and industrial upgrading, the rigid-flex board market will inject more power into the development of the new energy vehicle industry and promote the new energy vehicle industry towards a better future.

The industry that uses HDI circuit boards the most reveals: Why can’t the communications industry do without it?

With the rapid development of science and technology, circuit board technology is also constantly improving. Among them, HDI circuit boards stand out in many industries with their high-density interconnection characteristics, especially in the application of the communications industry. So why does the communications industry rely so much on HDI circuit boards?

1. HDI circuit boards: a powerful assistant in the communications industry
HDI circuit boards are high-density interconnected circuit boards using micro-blind buried hole technology. Its appearance has greatly met the communication industry’s demand for high-density and high-frequency signal transmission. In the manufacture of communication equipment, HDI circuit boards can achieve a more compact design, making the equipment smaller and more powerful. At the same time, HDI circuit boards also have strong signal processing capabilities, which can meet multiple functions such as high-frequency communication, data transmission, and image processing, providing a strong guarantee for the stable operation of communication equipment.

2. Why the communications industry cannot do without HDI circuit boards
High-density interconnection: The high-density interconnection characteristics of HDI circuit boards make the circuit board design of communication equipment more compact, reducing the size and weight of the equipment. This is especially important for portable communication devices such as smartphones, routers, and switches, because they need to reduce the size and weight as much as possible while ensuring performance to meet user needs.

High-frequency signal transmission: The communication industry has extremely high requirements for signal transmission speed, and HDI circuit boards just meet this demand. The high-density interconnection technology it adopts makes the signal transmission speed faster and more stable, thereby ensuring the communication quality and stability of communication equipment.
Powerful signal processing capabilities: HDI circuit boards have powerful signal processing capabilities and can meet the various functional requirements of communication equipment. Whether it is high-speed data transmission, image processing or audio transmission, HDI circuit boards can easily cope with it, providing strong support for the diversified functions of communication equipment.

High reliability: HDI circuit boards use advanced manufacturing technologies to ensure the quality and reliability of circuit boards. These technologies include fine control of line width and interlayer distance, as well as strict monitoring of materials and production processes. These high-standard manufacturing processes ensure that communication equipment can operate stably in various environments, whether in hot deserts or cold Arctic.

3. The future of the communication industry and HDI circuit boards
With the continuous development of new-generation communication technologies such as 5G, the communication industry has higher and higher requirements for circuit board technology. As a high-density interconnection circuit board, HDI circuit boards have a very broad application prospect. In the future, with the continuous advancement of communication technology and the continuous upgrading of communication equipment, the application of hdi circuit boards in the communication industry will be more extensive, providing strong support for the sustainable development of the communication industry.

HDI circuit boards play a vital role in the communication industry with their high-density interconnection, high-frequency signal transmission, powerful signal processing capabilities and high reliability. With the continuous development of communication technology, the application prospects of hdi circuit boards will be broader, injecting new vitality into the sustainable development of the communication industry.