14-layer thick copper PCB

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In the field of electronic circuits, the quality and performance of PCB directly affect the overall performance of electronic devices. We bring you a 14-layer thick copper board. Let us take a deeper look at the 14-layer PCB with both inner and outer layers of 2oz and appreciate its unique charm and advantages.

The 2oz copper foil thickness of the inner and outer layers gives this PCB excellent current carrying capacity. In high-power electronic devices, such as power supplies, motor drive devices, etc., it can easily cope with the transmission needs of large currents, effectively reduce line impedance, and reduce power loss, thereby improving the energy efficiency and stability of the equipment. Whether it is the core control board of industrial automation equipment or the power distribution board of high-end servers, 2oz copper thick PCB can provide reliable power support.

Let’s take a look at its slice diagram：

The 14-layer multi-layer structure design provides a good shielding and isolation environment for signal transmission. The reasonable layout and wiring between each layer, combined with the stability of 2oz copper foil, can effectively control signal transmission, crosstalk and other issues. For application scenarios with extremely high requirements for signal quality, such as high-speed digital circuits and radio frequency communication circuits, this PCB can ensure the integrity and accuracy of the signal, allowing high-speed and stable data transmission, laying a solid foundation for the high-performance operation of the equipment. For example, in the signal processing module of a 5G base station, it can ensure the fast and accurate interaction of massive data!

 

4-layer step PCB, spray printed solder mask

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In the conventional step PCB products we make, the step position is generally treated with a window as the connection position of the components. As can be seen from the above picture, this product of ours has soldering done at the step position. The production of solder mask requires keeping the surface of the PCB work board flat, otherwise the silk screen ink will not cover it completely. Previously, the method we adopted was to silk screen the solder mask once before lamination. This method has great disadvantages. The ink after silk screen printing will become very brittle under lamination, and there is a high probability that the ink will fall off in the subsequent process. For this reason, we have thought of many solutions, but the effect is not very good.

After many attempts, our engineers came up with a solution, which is to use the principle of a character printer to print solder mask ink. No solder mask is applied before lamination, and solder mask is applied to the step part by printing after the finished product comes out. The result of the product is indeed satisfactory!

The above picture is the slice measurement data of our PCB. All aspects of the PCB data meet the customer’s requirements. In addition to the steps, this PCN also has yin and yang copper, half hole and other designs.

Buried copper block PCB is the cornerstone of circuit with excellent performance

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The buried copper block PCB, literally speaking, means that copper blocks are buried inside the PCB. These copper blocks play a very important role in the circuit system. First of all, its excellent heat dissipation ability is a highlight. With the trend of increasingly miniaturized electronic devices and increasingly enhanced functions, the heating problem of electronic components is becoming more and more serious. The copper blocks in the buried copper block PCB have good thermal conductivity and can quickly conduct heat away to ensure that electronic components work at a suitable temperature. For example, in the PCB of a high-performance server, a large amount of data processing causes the chip to heat up seriously. The buried copper block design can effectively prevent the chip from overheating and causing performance degradation or damage.

 

Today, we bring you a pure buried copper block PCB produced by BEST PCBA. The product does not have any complicated circuit production. The entire SET is made up of small copper blocks embedded on the board one by one. The base material of the product is a commonly used TUC-872 high-speed board. Different from conventional buried copper PCBs, the entire SET of our product is composed of copper blocks one by one. Direct etching will cause the copper blocks to scatter. During production, our engineers first etch the corresponding circuit pattern on the copper plate, and then press PP on the copper plate to fix the position of the copper block.

 

The above is a slice of our product. It is not difficult to see that the entire copper block is perfectly embedded in the board without any traces of splicing. The product has been perfectly delivered to the customer. If you encounter any problems in PCB production in the future, you can find BEST PCBA. Our strong team of engineers will do their best to serve you!

Special PCB board material product display

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At present, most PCB substrates are made of FR-4 glass fiber substrate. This material has good insulation, corrosion resistance, high temperature resistance, and high cost performance, so most PCBs use this as the substrate.

However, for some products with specific electrical performance requirements, the performance of conventional substrates is not enough. These special properties require the use of some special substrates to meet them. Today, we will introduce some common special substrate products.

TUC  872LK

   

The above is an 8-layer HDI PCB of TUC872. TUC872 is a high-speed special board that we often use. It has a low dielectric constant, which is conducive to the transmission of high-speed signals. It also has a low dielectric loss factor, which means low energy loss during signal transmission, ensuring the strength of signal transmission!

VT-901

This pancake-like PCB is made of VT-901 polyimide material. The ultra-high strength board performance enables the product to adapt to most harsh environments. Whether it is high temperature and high pressure, or low temperature and low pressure, it can perform its due functions well!

Rogers 4003C

RO4003 is a material with a hydrocarbon resin system and ceramic filler reinforced with woven glass cloth, and its electrical properties are close to those of PTFE/woven glass cloth materials. It is an excellent high-frequency PCB substrate with a stable dielectric constant. It can ensure the stability and accuracy of signal transmission in high-frequency circuits, and give the circuit good impedance control. It is widely used in microstrip line design, cellular base station antennas, point-to-point microwave communications, etc., and can ensure high-speed data transmission and stable signal coverage. For example, in the construction of 5G communication base stations, RO4003C can be used to make PCBs for base station antennas to meet the transmission requirements of 5G high-frequency signals.

High frequency mixed pressing Copper paste plugging Deep groove control Metal edging PCB

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With the rapid development of electronic technology today, PCB is the core component of electronic equipment, and its performance directly affects the quality and reliability of the entire electronic equipment. Most of the PCB products we usually see are made of a single core material, which is fine for conventional PCBs, but for some high-frequency and high-speed PCB products, the board value is relatively high. Mixing can save material costs. What we bring today is a Rogers 4003+IT180A mixed high-frequency PCB.

This product has a 6-layer PCB, L1-2 is high-frequency Rogers material, and L3-6 is conventional IT180 glass fiber material. This lamination structure saves material costs to a great extent while retaining the high-frequency performance of the product. However, mixed pressing is also a test of lamination technology. Core boards of different materials are prone to delamination during lamination, or layer deviation due to different expansion and contraction of the board. The lamination parameters of mixed pressing are more stringent than those of ordinary pressing.

The following figure is the pressing structure diagram of the product:

In addition, the product’s via process uses copper paste plugging. Copper paste has excellent electrical conductivity. In high-frequency and high-speed circuits, signal transmission has very strict requirements on conductivity. Copper paste plugging can effectively reduce the resistance and loss of signal transmission and ensure the integrity and accuracy of signal transmission.

 

PCB also has metal edging and controlled depth groove design. Metal edging can enhance the mechanical strength of the product, prevent edge wear, and have a certain electromagnetic shielding effect to prevent circuit signal interference. Controlled depth groove can facilitate the installation and fixation of components. Reasonable controlled depth groove design can reduce signal interference. By placing some sensitive components or signal lines in specific controlled depth grooves, electromagnetic interference with other components or signal lines can be avoided, improving the quality and stability of signal transmission.

 

How to solve the delay problem of wireless HDMI adapter circuit board?

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Latency issues with the wireless HDMI adapter circuit board may affect the synchronization of video and audio, especially in application scenarios that require real-time feedback. Here are some ways to solve latency issues:

1. Choose a low-latency wireless HDMI adapter: Some adapters on the market specifically advertise low latency features. Choosing such products can effectively reduce latency.

2. Update firmware and drivers: Make sure the adapter’s firmware and drivers are up to date. Manufacturers sometimes improve latency issues through firmware updates.

3. Adjust transmission parameters: Adjust parameters such as resolution, frame rate, and compression rate in the adapter’s settings to find the best latency balance.

4. Optimize wireless signals: Make sure the wireless signal is unobstructed, minimize obstacles, and use signal boosters or repeaters to extend the transmission range.

5. Use a wired connection: If the latency problem is very serious, consider using a wired HDMI connection as an alternative.

6. Use near-field communication (NFC): Some adapters support NFC, which can quickly pair devices and reduce latency during initial setup.

7. Restart devices: Restarting all related devices, including source devices, adapters, and display devices, can sometimes solve temporary latency issues.

8. Check power and connections: Make sure the power connections of all devices are stable, without power outages or voltage fluctuations.

9. Test different wireless channels: Wireless HDMI adapters usually support multiple wireless channels. Try using different channels to reduce interference.

10. Consult the manufacturer: If none of the above methods can solve the problem, you can contact the manufacturer’s customer service support for professional technical help.

Because the performance of the wireless HDMI adapter circuit board is affected by many factors, solving the delay problem may require trying multiple methods. In addition, as technology continues to develop, new solutions and products may continue to emerge.

How to solve the material compatibility problem in SMT patch processing?

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The key to solving the material compatibility problem in SMT patch processing is to ensure that all materials used can remain stable during the processing and will not produce adverse reactions with each other. The specific analysis is as follows:

1. Choose the right solder paste. Solder paste matching: Select the right solder paste according to the heat capacity and welding temperature of the PCB board and components. Solder paste composition analysis: Ensure that the components in the solder paste are compatible with the metal plating of the PCB board and components to avoid adverse reactions.

2. Evaluate the heat resistance of the substrate material. Select a substrate material that can withstand the high temperature during the SMT patch processing to prevent the substrate from being deformed or damaged. Surface treatment suitability: Consider the substrate surface treatment process, such as tin spraying, OSP (organic protective agent), silver, etc., to ensure a good welding effect.

3. Consider the compatibility of component materials and component packaging materials: Check whether the packaging materials of the components can adapt to the automated production line of the SMT machine to avoid reduced production efficiency due to material incompatibility. Component heat resistance: Ensure that all components can withstand the high temperature during SMT patch processing to prevent component damage.

4. Optimize the process temperature curve optimization: adjust the temperature curve of reflow soldering according to the characteristics of different materials to ensure the quality of welding while avoiding material damage. Process control: implement strict process control, including the management of temperature and humidity in the production environment to reduce the instability of materials caused by environmental changes.

5. Conduct tests to verify compatibility tests: conduct small batch compatibility tests before formal production to verify the compatibility between different materials. Reliability testing: conduct comprehensive reliability tests on samples that have completed SMT patch processing, including but not limited to temperature cycle tests, mechanical impact tests, etc., to ensure long-term stability.

To solve the material compatibility problem in SMT patch processing, it is necessary to start from multiple angles and comprehensively consider the physical and chemical properties of various materials, which can effectively reduce the risks caused by material incompatibility and improve production efficiency and PCBA product quality.

What are the application cases of wireless charger circuit boards in different industries?

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The application cases of wireless charger circuit boards in different industries are very extensive, covering multiple fields such as consumer electronics, automotive electronics, smart home, medical equipment and industrial applications. The following are some specific application cases:

Consumer electronics industry

1. Smartphones and tablets: Smartphones and tablets are one of the most common applications of wireless charger circuit boards. Users only need to place their mobile phones or tablets on the wireless charging pad to achieve a cable-free charging experience. This convenience makes wireless charging very popular in the consumer market.

2. Wearable devices: Wearable devices such as smart watches and wireless headphones also support wireless charging. These devices usually have a small battery capacity but a high frequency of use. The convenience of wireless charging is of great significance to improving user experience.

Automotive electronics industry

1. Wireless charging of electric vehicles: Wireless charging technology for electric vehicles is gradually maturing and commercializing. The wireless charging system is divided into a transmitter (installed on the ground or parking space) and a receiver (installed at the bottom of the electric vehicle). When the electric vehicle is parked in the charging area, the wireless transmission of electrical energy is achieved through the principle of electromagnetic induction. This technology reduces physical contact during charging and improves the convenience and safety of charging.

2. Car wireless charger: Many car PCB manufacturers have integrated wireless chargers in the car to facilitate drivers and passengers to wirelessly charge mobile phones and other devices. This design not only enhances the sense of technology in the car, but also avoids the problem of cable clutter caused by traditional wired charging.

Smart home industry

1. Wireless charging of smart home devices: In the field of smart home, wireless charging technology is also widely used in various smart devices. For example, smart speakers, smart door locks and other devices can be charged through wireless charging plates without frequent battery replacement or plugging and unplugging charging cables.

2. Furniture integrated wireless charging: Some high-end furniture such as coffee tables and bedside tables also integrate wireless charging functions. Users only need to place mobile phones and other devices on furniture to charge. This design not only improves the practicality of furniture, but also increases the convenience of home life.

Medical equipment industry

1. Wireless charging of medical instruments: In the field of medical equipment, wireless charging technology is used to charge various portable medical instruments. For example, electrocardiographs, blood glucose meters and other devices can be charged through wireless charging plates, avoiding the risk of cross infection that may be caused by traditional wired charging.

2. Wireless charging of medical robots: Medical robots such as surgical robots and nursing robots also use wireless charging technology. This technology allows robots to perform tasks without frequently returning to charging stations for charging, improving work efficiency and safety.

Industrial applications

1. Wireless charging of industrial equipment: In the industrial field, wireless charging technology is used to charge various industrial equipment. For example, robots, drones and other equipment on automated production lines can be charged through wireless charging pads, reducing manual intervention and downtime.

2. Wireless charging of industrial environment monitoring equipment: Some industrial environment monitoring equipment such as temperature sensors and humidity sensors also use wireless charging technology. These devices are usually deployed in inaccessible or dangerous environments. Wireless charging technology eliminates the need for maintenance personnel to frequently enter these environments for charging operations.

There are many application cases of wireless charger circuit boards in different industries. With the continuous advancement of technology and the reduction of costs, wireless charging technology will be widely used and promoted in more fields.

12-layer Rigid-Flex HDI PCB

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The development of PCB can be traced back to the 1950s, when it started with the quantitative production of some single-sided and double-sided PCBs. In the 1970s, multi-layer PCBs developed rapidly, and continued to move towards high precision, high density, and high reliability. This also laid the foundation for the rigid-flex board. In the birth and continuous development of FPC and PCB, a new product, the rigid-flex board, was born. It can be said that the rigid-flex board is the youngest member of the PCB family.

Early Rigid-Flex PCBs were mainly used in military and aerospace fields that have extremely high requirements for reliability and performance, such as aircraft, missiles and other high-end equipment. Today  SHENZHEN BEST PCBA CO.,LIMITED bring you a 12-layer HDI Rigid-Flex PCB, let’s take a look at it first!

Rigid-flex boards can be said to be a beautiful work of art in PCB products! In the same level of rigid-flex boards, a variety of different stacking structures can be produced. For example, a 12-layer rigid-flex board can be a 10-layer rigid board + 2-layer flex board structure, or an 8-layer rigid board + 4-layer flex board structure, or a 6-layer rigid board + 6-layer flex board structure. The layer settings of soft and hard boards are not fixed, and can be set by engineers according to their needs! The internal structure of our 12-layer rigid-flex board is 8-layer rigid board + 4-layer flex board. Let’s appreciate its stacking structure:

 

L5-6, L7-8 are four-layer flex boards, and the other layers are FR4 rigid boards. In addition, this product is a 1 step blind and buried HDI. In order to ensure the stability and reliability of the product, we use  plugged with resin technology to fill the buried hole part, and the blind hole part is filled with electroplating.

Of course, this product is not used in general electronic equipment. It is a PCB for industrial control equipment!

We delivered the product perfectly to our customers!

 

How to understand the minimum rules for PCB line spacing and hole spacing?

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With the trend of miniaturization and complexity of modern electronic devices, the accuracy and rationality of the design of PCB printed circuit boards as a connecting bridge between electronic components are particularly important. The design of PCB is not only related to the stable performance of the product, but also directly affects the manufacturing cost and production efficiency. Among the many design rules, the minimum setting of PCB line spacing (the distance between line widths) and hole spacing (the distance from the edge of the hole to the adjacent wire) is one of the key factors to ensure the normal operation of the circuit, avoid short circuits and improve the success rate of manufacturing.

Overview of PCB line spacing and hole spacing PCB line spacing refers to the minimum allowable distance between the center lines of any two conductive lines on the PCB. This distance must be large enough to prevent accidental electrical connections (i.e. short circuits) caused by damage to insulating materials during the manufacturing process or when the circuit is running. The size of the line spacing is affected by many factors such as the materials used, manufacturing process, operating voltage, expected current, and expected working environment.
Hole spacing refers to the minimum allowable distance from the edge of the hole (via used to install component pins or realize interlayer connection) on the PCB to the edge of the nearest wire. Reasonable hole spacing design can ensure that the drilling and copper plating process will not damage the adjacent wires, while reducing the crosstalk between signals and ensuring the signal integrity of the circuit.

Why is the minimum spacing rule established?

1. Electrical safety: Too small line spacing and hole spacing may cause current leakage, causing short circuits, and in severe cases, damage the circuit board or even the entire system.

2. Manufacturing feasibility: Different manufacturing processes have their technical limitations, such as etching accuracy, drilling accuracy, etc. Too small spacing will increase the difficulty of manufacturing and reduce the yield rate.

3. Signal integrity: Electromagnetic interference is easily generated between conductors that are too close, affecting the quality of signal transmission, causing signal attenuation, delay or distortion.

4. Thermal management: Dense layout may hinder heat dissipation and affect the long-term reliability and life of components.

Factors affecting the minimum spacing Circuit operating voltage and current: High voltage or high current circuits require larger line spacing to reduce the risk of breakdown. Signal frequency: High-frequency signals are more sensitive to line spacing to reduce crosstalk and ensure signal quality. Manufacturing process: Advanced manufacturing technology can support smaller line spacing and hole spacing, but the cost increases accordingly. Environmental factors: such as temperature cycling, humidity, etc., require more conservative designs to improve reliability in harsh environments.

Design practice recommendations Follow manufacturer guidelines: Each PCB manufacturer will provide specific manufacturing capability parameters, including minimum line spacing and hole spacing requirements, which must be strictly followed during design. Use design software assistance: Modern PCB design software usually has a built-in DRC (design rule check) function to help designers automatically detect and adjust line spacing and hole spacing that do not meet specifications. Reserve margin: Under the premise of meeting performance requirements, appropriately increase line spacing and hole spacing to leave room for manufacturing tolerances and potential design modifications. Multilayer board design considerations: For multilayer boards, it is also necessary to consider the impact of inter-layer alignment and via penetration on adjacent layers for comprehensive design.

In short, the line spacing and hole spacing of PCBs are one of the most basic and critical design elements, which are directly related to the performance, reliability and manufacturing cost of the circuit board. By deeply understanding these rules and combining specific project requirements and manufacturing capabilities, designers can effectively avoid common design errors and create electronic products that are both efficient and reliable.