PCB Assembly Capability
We are professional on PCB and turnkey PCBA solution, owing to the past over 10 years rich experience of manufacturing.
Products Details
| Stencil size range： | 1300*450mm |
| Min. SMT package： | 01005 |
| Component range： | Chip(from 01005), SOIC, SOT, SOD, TSOP,MELF, CSP, QFP(low profile), DPAK, flip chip, odd-shape |
| Component specification： | min: 0.4 x 0.2 mm (0.016″ x 0.008″) (01005) max: 56 x 56 x 2.54 mm (2.20″ x 2.20″ x0.10″) |
| max: component weight: 140 g | |
| Maximum board size： | 500 x 580mm |
| Minimum board size : | No Limited |
| Max. component height: | 25mm |
| Board thickness range : | 0.1 – 8.0mm |
| Board edge clearance top and bottom: | 3.2 mm |
| Chip Accuracy : | 75um, 26° |
| Min. IC pitch : | 0.3mm |
| Max. BGA Size : | 73*73mm |
| BGA ball pitch BGA : | 1.00 to 3.00mm |
| BGA ball diameter BGA: | 0.4 to 1.0mm |
| QFP lead pitch QFP : | 0.38 to 2.54mm |
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