Everyone knows about PCB, but do you know about its wiring? As an integral part of the whole machine, a PCB generally cannot constitute an electronic product, and there must be problems with external connections. For example, electrical connections are required between PCBs, between PCBs and off-board components, and between PCBs and equipment panels. PCB wiring can be said to be a basic course for every electronic engineer. The following is a brief analysis of the wiring of each PCB component for your reference.

In more complex instruments and equipment, plug-in connectors are often used. This “building block” structure not only ensures the quality of product mass production, reduces the cost of the system, but also provides convenience for debugging and maintenance. When equipment fails, maintenance personnel do not have to check to the component level (that is, check the cause of the failure and trace it back to the specific components. This work takes a lot of time), as long as they determine which board is abnormal. It can be replaced immediately, troubleshooting in the shortest possible time, shortening downtime and improving equipment utilization. The replaced circuit board can be repaired in ample time and used as spare parts after repair.

Flexible Printed Circuit Board (FPC) is a flexible electronic component that is widely used in various electronic devices. It is different from traditional rigid circuit boards. Its main feature is that it can be bent, folded and twisted to adapt to various complex shapes and space constraints. In the field of modern technology, FPC is used more and more widely. Today we will reveal the secrets of flexible circuit boards and quickly understand the various types and uses of FPC.
First, let us understand the basic structure of fpc. FPC consists of conductive layer, insulating layer and protective layer. The conductive layer is usually made of copper foil and is used to transmit current and signals. The insulating layer is made of materials such as flexible polyimide and serves to isolate the conductive layer. The protective layer is used to protect the FPC from the external environment, such as moisture, dust and mechanical damage.
According to different application requirements, FPC can be divided into many types.
Single-sided FPC is the simplest type, with only one conductive layer, so the wiring density is not high, but it has good flex resistance.
Double-sided FPC has conductive layers on both sides, which is suitable for some scenarios that require more complex circuit layouts, but its softness is worse than that of single-sided panels.
Multilayer FPC, which has multiple conductive layers embedded inside, is suitable for more complex electronic devices.
Rigid-flexible board combines the characteristics of rigid circuit board and flexible circuit board, which can not only meet the needs of rigid structure, but also adapt to certain bending.

 

So, what are the main applications of fpc? First of all, FPC is widely used in mobile devices, such as smartphones, tablets, etc. Because FPC has high flexibility and foldability, it can adapt to the needs of equipment of various shapes and sizes. Secondly, it is also widely used in the field of automotive electronics. In cars, FPC can connect various sensors, displays and control modules to realize vehicle intelligence and automation. In addition, it is also commonly used in medical equipment, aerospace, industrial control and other fields to provide reliable circuit connections for various electronic devices.
Flexible circuit boards are flexible and foldable electronic components that are widely used in various electronic devices. By understanding the types and uses of FPC, we can better understand and apply this advanced electronic component and promote the development and innovation of science and technology.

The dangers of PCB board deformation

In automated surface mounting lines, if the circuit board is not flat, it will cause inaccurate positioning, components cannot be inserted or mounted into the board’s holes and surface mounting pads, and the automatic insertion machine may even be damaged.

The circuit board with the components on it is bent after soldering, and it is difficult to cut the component pins neatly. The board cannot be installed into the chassis or the socket inside the machine, so it is also very troublesome for the assembly factory to encounter a warped board.

The current surface mount technology is developing in the direction of high precision, high speed and intelligence, which puts forward higher flatness requirements for PCB boards, which are the homes of various components.

In the IPC standard, it is specifically stated that the allowable deformation of PCB boards with surface mount devices is 0.75%, and the allowable deformation of PCB boards without surface mount devices is 1.5%.

In fact, in order to meet the needs of high-precision and high-speed placement, some electronic assembly manufacturers have stricter requirements for deformation. If required, the allowed deformation is 0.5%, and some even require 0.3%.

PCB boards are composed of copper foil, resin, glass cloth and other materials. The physical and chemical properties of each material are different. After being pressed together, thermal stress residues will inevitably occur, leading to deformation.

At the same time, during the processing of PCB, various processes such as high temperature, mechanical cutting, and wet treatment will also have an important impact on the deformation of the board. In short, the causes of PCB board deformation are complex and diverse. How to reduce or eliminate the deformation due to material characteristics? Deformation caused by differences or processing has become one of the complex problems faced by PCB manufacturers.

Analysis of causes of PCB board deformation

The deformation of PCB board needs to be studied from several aspects such as material, structure, pattern distribution, processing process, etc. This article will analyze and elaborate on the various causes of possible deformation and improvement methods.

The uneven copper surface area on the circuit board will worsen the board bending and warping.

Generally, circuit boards are designed with a large area of copper foil for grounding purposes. Sometimes the Vcc layer is also designed with a large area of copper foil. When these large area copper foils cannot be evenly distributed on the same circuit board When it is installed, it will cause the problem of uneven heat absorption and heat dissipation speed.

Of course, the circuit board will also expand due to thermal expansion and contraction. If the expansion and contraction cannot occur at the same time, it will cause different stresses and deformation. At this time, if the temperature of the board has reached the upper limit of the Tg value, the board will begin to soften, causing deformation.

The connection points (vias, vias) of each layer on the circuit board will limit the expansion and contraction of the board.

Most of today’s circuit boards are multi-layer boards, and there are connection points (vias) like rivets between layers. The connection points are divided into through holes, blind holes and buried holes. Where there are connection points, the board will be restricted. The effect of expansion and contraction will also indirectly cause the board to bend and warp.

Reasons for PCB board deformation:

(1) The weight of the circuit board itself will cause the board to dent and deform.

Generally, reflow furnaces use chains to drive the circuit board forward in the reflow furnace, that is, using both sides of the board as fulcrums to support the entire board.

If there are overweight parts on the board, or the size of the board is too large, there will be a dent in the middle due to its own weight, causing the board to bend.

(2) The depth of the V-Cut and the connecting strip will affect the deformation of the panel.

Basically, V-Cut is the culprit that destroys the structure of the board. Because V-Cut cuts grooves into the original large sheet, the V-Cut is prone to deformation.

The influence of laminating materials, structures, and graphics on plate deformation:

The PCB board is composed of a core board, a prepreg, and an outer layer of copper foil. The core board and copper foil are thermally deformed during lamination. The amount of deformation depends on the coefficient of thermal expansion (CTE) of the two materials.

The thermal expansion coefficient (CTE) of copper foil is about 17X10-6; while the Z-direction CTE of ordinary FR-4 substrate at the Tg point is (50~70)X10-6; above the TG point it is (250~350)X10-6 , X-direction CTE is generally similar to copper foil due to the presence of glass cloth.

Deformation caused during PCB board processing

The causes of PCB board deformation during processing are very complex and can be divided into two types of stress: thermal stress and mechanical stress.

Thermal stress is mainly generated during the lamination process, and mechanical stress is mainly generated during the stacking, handling, and baking processes of panels. The following is a brief discussion in process order.

1. Incoming copper clad laminate materials:

Copper-clad laminates are all double-sided with symmetrical structure and no graphics. The CTE of copper foil and glass cloth are almost the same, so there is almost no deformation caused by different CTE during the lamination process.

However, the size of the copper-clad laminate press is large, and there are temperature differences in different areas of the hot plate, which will lead to slight differences in the resin curing speed and degree in different areas during the lamination process. At the same time, the dynamic viscosity at different heating rates is also significantly different, so there will also be Local stresses due to differences in the curing process.

Generally, this stress will maintain balance after pressing, but will gradually release and cause deformation during subsequent processing.

2. Pressing:

The PCB lamination process is the main process that generates thermal stress. Similar to the lamination of copper-clad laminates, it will also produce local stress caused by differences in the curing process. The thermal stress of PCB boards is due to thicker thickness, diverse pattern distribution, and more prepregs. The stress will also be more difficult to eliminate than that of copper clad laminate.

The stress existing in the PCB board is released during subsequent drilling, shaping or grilling processes, causing the board to deform.

3. Baking process of solder mask, characters, etc.:

Since the solder mask ink cannot be stacked on top of each other when curing, the PCB boards will be placed vertically in a rack for curing. The solder mask temperature is about 150°C, which is just above the Tg point of medium and low Tg materials. The resin above the Tg point is in a highly elastic state, and the board Parts are easily deformed under their own weight or strong wind from the oven.

4. Hot air solder leveling:

When leveling hot air solder for ordinary boards, the tin furnace temperature is 225℃~265℃ and the time is 3S-6S. The hot air temperature is 280℃~300℃.

The solder leveling plate enters the tin furnace at room temperature, and is post-processed and washed at room temperature within two minutes after coming out of the furnace. The entire hot air solder leveling process is a sudden heating and cooling process.

Due to different circuit board materials and uneven structures, thermal stress will inevitably occur during the cooling and heating process, resulting in microscopic strain and overall deformation and warping.

5. Storage:

PCB boards are generally stored vertically in racks during the semi-finished product stage. Improper adjustment of the rack’s tightness or stacking of boards during storage will cause mechanical deformation of the boards. Especially for thin plates below 2.0mm, the impact is more serious.

In addition to the above factors, there are many factors that affect PCB board deformation.

Prevention of PCB board warpage and deformation

Circuit board warpage has a great impact on the production of printed circuit boards. Warpage is also one of the important problems in the circuit board production process. The board with components on it will bend after welding, making it difficult for the component legs to be neat.

The board cannot be installed into the chassis or the socket inside the machine. Therefore, the warping of the circuit board will affect the normal operation of the entire subsequent process.

At this stage, printed circuit boards have entered the era of surface mounting and chip mounting, and the process requirements for circuit board warpage are getting higher and higher. So we need to find the reason why the circuit board is warping.

1. Engineering design:

Things to note when designing printed circuit boards:

A. The arrangement of prepreg sheets between layers should be symmetrical. For example, for a six-layer board, the thickness between layers 1 to 2 and 5 to 6 should be consistent with the number of prepreg sheets, otherwise it will easily warp after lamination.

B. Multilayer core boards and prepregs should use products from the same supplier.

C. The line pattern areas on the outer layer A and B should be as close as possible. If side A is a large copper surface and side B only has a few lines, this kind of printed board will easily warp after etching. If the line areas on the two sides are too different, you can add some independent grids on the sparse side for balance.

2. Drying plate before unloading:

The purpose of drying the copper-clad laminate (150 degrees Celsius, 8 ± 2 hours) before unloading is to remove the moisture in the board, and at the same time completely solidify the resin in the board, further eliminating the remaining stress in the board, which is helpful in preventing the board from warping. helpful.

At present, many double-sided and multi-layer boards still adhere to the step of drying the boards before or after cutting. However, there are exceptions for some board factories. Currently, the drying time regulations of various PCB factories are inconsistent, ranging from 4 to 10 hours. It is recommended to decide based on the grade of the printed boards produced and the customer’s requirements for warpage.

Both methods are feasible, whether to cut the pieces into panels and then bake them or to bake them as a whole piece and cut them out. It is recommended to cut the materials and then bake them. The inner layer boards should also be baked.

3. Longitude and latitude direction of prepreg:

The warp and weft shrinkage rates of prepregs after lamination are different, and the warp and weft directions must be distinguished when blanking and laminating. Otherwise, it is easy to cause the finished board to warp after lamination, which is difficult to correct even if pressure is applied to bake the board.

Many reasons for the warping of multi-layer boards are caused by not distinguishing the longitude and weft directions of the prepreg sheets during lamination, and they are stacked randomly.

How to distinguish longitude and latitude? The rolling direction of the rolled prepreg is the warp direction, and the width direction is the weft direction; for copper foil boards, the long side is the weft direction, and the short side is the warp direction. If you are not sure, you can check with the manufacturer or supplier.

4. Stress relief after lamination:

After completing the hot and cold pressing, the multi-layer board is taken out, the burrs are cut or milled, and then placed flat in an oven at 150 degrees Celsius for 4 hours to gradually release the stress in the board and completely solidify the resin. This step cannot be omitted.

5. Thin sheets need to be straightened during electroplating:

When using 0.4~0.6mm ultra-thin multi-layer boards for surface electroplating and pattern electroplating, special clamp rollers should be made. After clamping the thin plate on the fly bar of the automatic electroplating line, use a round stick to clamp the entire fly bar. The rollers are strung together to straighten all the boards on the rollers so that the plated boards will not deform.

Without this measure, the sheet will bend after plating a copper layer of 20 to 30 microns, and it will be difficult to repair.

6. Cooling of the board after hot air leveling:

During hot air leveling, the printed board is subjected to the high temperature impact of the soldering bath (about 250 degrees Celsius). After being taken out, it should be placed on a flat marble or steel plate to cool naturally, and then sent to the post-processing machine for cleaning. This is very good for preventing the board from warping.

In order to enhance the brightness of the lead-tin surface, some factories put the board into cold water immediately after being leveled with hot air, and then take it out after a few seconds for post-processing. This kind of hot and cold impact may cause warping of some types of boards. Curved, layered or blistered.

In addition, an air flotation bed can be installed on the equipment for cooling.

7. Treatment of warped boards:

In a well-managed factory, 100% flatness inspection of printed boards will be carried out during final inspection. All unqualified boards will be picked out, placed in an oven, baked at 150 degrees Celsius under heavy pressure for 3 to 6 hours, and allowed to cool naturally under heavy pressure.

Then remove the pressure and take out the board, and then check the flatness. This can save part of the board. Some boards need to be baked and pressed two to three times before they can be flattened. If the above-mentioned anti-warping process measures are not implemented, baking and pressing some boards will be useless and they will have to be scrapped.
​

1. Overview of sensor pcb board
The sensor PCB board is a circuit board specially used for sensors, mainly used to measure and detect changes in environmental conditions or object characteristics. It realizes signal collection, processing and transmission by combining sensor elements with circuit boards. Among them, common sensor PCBs mainly include temperature sensor PCBs, photoelectric sensor PCBs, pressure sensor PCBs, etc.
2. Temperature sensor pcb
Temperature sensor PCB is mainly used to measure and control the temperature of objects. The sensor elements used are usually thermistors, thermocouples or semiconductor temperature sensors. By tightly integrating sensor components with PCB, real-time monitoring and control of temperature can be achieved, which is widely used in home appliances, automobiles, medical equipment and other fields.
3. Photoelectric sensor PCB
Photoelectric sensor PCB is mainly used to detect the light intensity and position of objects. Common photoelectric sensor PCB types include photoresistor sensor PCB, photodiode sensor PCB, laser sensor PCB, etc. By combining these sensor components with PCB, functions such as measurement of light intensity and position detection of objects can be realized, and are widely used in fields such as automation control and security monitoring.
4. Pressure sensor pcb
Pressure sensor pcb is used to measure pressure changes of gas or liquid. The sensor elements usually use piezoresistive, capacitive or electronic oscillator sensors. By combining these sensor components with PCBs, pressure monitoring and control can be achieved, and are widely used in industrial automation, energy management, environmental monitoring and other fields.
Sensor PCBs play an important role in various fields. By combining with different types of sensor elements, they can achieve accurate measurement and control of physical quantities such as temperature, light intensity, and pressure. With the continuous advancement of technology, sensor PCBs will be more widely used in various industries, bringing more convenience and innovation to our lives and work.

Circuit board thick copper board is an indispensable key component in electronic equipment. It provides stable electrical connection and good thermal conductivity, providing strong power for the normal operation of the equipment. This article will elaborate on the thick copper board of circuit board from the following four aspects, including material properties, manufacturing process, application fields and future development trends.
1. Material properties
Thick copper boards have excellent electrical conductivity and thermal conductivity. Compared with ordinary circuit boards, thick copper boards have higher current carrying capacity and lower line impedance, and can meet the needs of high-frequency and high-power equipment. In addition, thick copper plates also have good corrosion resistance and mechanical strength, and can operate stably in various harsh environments.
2. Manufacturing process
The manufacturing process of thick copper boards is relatively complex and requires multiple processes. The first is material selection and cutting. Select copper plates with high purity and fine crystallization as raw materials, and use precision cutting equipment to cut them into the required shape. Then comes surface treatment, including chemical cleaning and anti-oxidation treatment to ensure the purity and stability of the circuit board surface. Next comes pattern drawing and copper lamination, using photolithography technology for image transfer, and laminating the copper foil to the substrate through high temperature and high pressure. Finally, there are processes such as drilling, lead-tin plating, printing and testing to complete the manufacturing of the entire circuit board.
3. Application fields
Thick copper boards are widely used in various high-power and high-frequency electronic equipment, including communication equipment, computer equipment, power supply equipment, automotive electronics, etc. In communication equipment, thick copper plates are used to make high-frequency radio frequency modules and antennas; in computer equipment, thick copper plates are used to make high-performance CPU radiators and cooling modules; in power supply equipment, thick copper plates are used to make high-performance Current DC bus and current sampling resistor, etc. Due to its excellent performance, thick copper boards are also widely used in fields such as new energy vehicles and aerospace.
4. Future development trends
With the continuous development and upgrading of electronic equipment, the requirements for circuit boards are becoming higher and higher. In the future, circuit board thick copper boards will continue to develop towards high density, high performance and multi-function. For example, multi-layer stacking technology and new materials are used to achieve a more compact design and higher circuit integration; advanced heat dissipation technology is used to improve heat dissipation efficiency and meet the thermal management needs of new generation equipment; flexible circuit technology is used to achieve Bending and folding expand the application scenarios of circuit boards. To sum up, circuit board thick copper plate is the key to success in electronic equipment and will help technology achieve new breakthroughs in continuous innovation and development.

As a key component in electronic equipment, circuit board thick copper boards have excellent material properties and manufacturing processes. It is widely used in many fields and provides strong power for the normal operation of equipment. With the continuous development and advancement of electronic equipment, thick copper boards will continue to develop in terms of high density, high performance and multi-function, helping to achieve technological breakthroughs. It is believed that circuit board thick copper board manufacturers will continue to provide innovative products and services to meet market demand and promote the development of the electronics industry.